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NDT452AP Datasheet(PDF) 3 Page - Fairchild Semiconductor |
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NDT452AP Datasheet(HTML) 3 Page - Fairchild Semiconductor |
3 / 6 page Electrical Characteristics (T A = 25°C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS I S Maximum Continuous Drain-Source Diode Forward Current -2.5 A V SD Drain-Source Diode Forward Voltage V GS = 0 V, IS = -2.5 A (Note 2) -0.85 -1.2 V t rr Reverse Recovery Time V GS = 0 V, IF = -2.5 A, dIF/dt = 100 A/µs 100 ns Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. PD (t) = TJ−TA RθJA(t) = TJ−TA R θJC+RθCA(t ) = I D 2 (t) × R DS (ON ) TJ Typical RθJA using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment: a. 42 oC/W when mounted on a 1 in2 pad of 2oz copper. b. 95 oC/W when mounted on a 0.066 in2 pad of 2oz copper. c. 110 oC/W when mounted on a 0.0123 in2 pad of 2oz copper. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. NDT452AP Rev. B1 1a 1b 1c |
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