NDT452AP Rev. B1

Typical Thermal Characteristics

-20

-16

-12

-8

-4

0

0

3

6

9

12

I

, DRAIN CURRENT (A)

T

= -55°C

J

25°C

D

V

= -10V

DS

125°C

Figure 13. Transconductance Variation with Drain

Current and Temperature.

0

0.2

0.4

0.6

0.8

1

0.5

1

1.5

2

2.5

3

3.5

2oz COPPER MOUNTING PAD AREA (in

)

2

1c

1b

1a

4.5"x5" FR-4 Board

T

= 25 C

Still Air

A

o

Figure 14. SOT-223 Maximum Steady- tate

Power Dissipation versus Copper

Mounting Pad Area.

Figure 16. Maximum Safe Operating Area.

0

0.2

0.4

0.6

0.8

1

2

3

4

5

6

2oz COPPER MOUNTING PAD AREA (in

)

2

1c

1b

1a

4.5"x5" FR-4 Board

T

= 25 C

Still Air

V

= -10V

A

o

GS

0.1

0.2

0.5

1

2

5

10

30

50

0.01

0.05

0.1

0.5

1

5

10

20

50

- V

, DRAIN-SOURCE CURRENT (V)

DS

10ms

100ms

10s

1s

DC

100us

1ms

RDS(ON)

LIMIT

V

= -10V

SINGLE PULSE

R

= See Note 1c

T

= 25°C

GS

A

Figure 15. Maximum Steady-State Drain

Current versus Copper Mounting Pad

Area.

Figure 17. Transient Thermal Response Curve

.

Note:

Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change

depending on the circuit board design.

0.0001

0.001

0.01

0.1

1

10

100

300

0.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t

/ t

1

2

R

(t) = r(t) * R

R

= See Note 1 c

θJA

θJA

θJA

T - T

= P * R

(t)

A

J

P(pk)