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2-111196-3 Datasheet(PDF) 19 Page - Tyco Electronics |
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2-111196-3 Datasheet(HTML) 19 Page - Tyco Electronics |
19 / 100 page 19 Catalog 82012 Dimensions are shown for Dimensions are in inches Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666 Revised 4-12 reference purposes only. and millimeters unless Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686 Specifications subject otherwise specified. Latin/S. Am.: +54 (0) 11-4733-2200 Netherlands: +31 (0) 73-6246-999 www.te.com to change. USA: +1 (800) 522-6752 Germany: +49 (0) 6251-133-1999 China: +86 (0) 400-820-6015 Board-to-Board Vertical Receptacles and Headers Ribbon Cable Interconnect Solutions Product Facts I Surface-mount products for parallel board-to-board applications, as well as right-angle board-to-board and cable-to-board applications I High density .050 x .050 [1.27x1.27] centerline grid I Three board-to-board stack heights: .250 [6.35], .320 [8.13] and .390 [9.91] I Non-protrusive metallic holddowns I Reliable dual beam receptacle contacts for redundant contact I Duplex plated receptacle and post contacts; gold plated on mating areas, tin plated on tails I Compatible with standard surface-mount processing (VPR and IR) I Receptacle and header allow for drainage of processing fluids I Tape and reel packaging available. Contact TE for details I Polarized header and receptacle assemblies I Sizes of 10, 20, 30, 40, 50, 60, 70, 80 and 100 positions I Recognized under the Component Program of Underwriters Laboratories Inc., File No. E28476 I Certified by Canadian Standards Association File No. LR7189 AMPMODU 50/50 Grid Vertical Headers and Receptacles are designed for parallel board-to-board stacking in high density applications. Right-angle board-to-board and cable-to-board applications are also possible, since the vertical receptacles also mate with non-latching right-angle headers (page 24) and the vertical headers also mate with non-latching cable connectors. Available are double row, vertical shrouded headers and receptacles in sizes ranging from 10 through 100 positions (in 10 position increments). Parallel board-to-board stack heights of .250 [6.35], .320 [8.13] and .390 [9.91] are achievable by selection of the appropriate header. The receptacle is the same for all three stack height headers. Non-protrusive metallic holddowns are designed for use in .062 [1.57] or thicker PC boards and allow surface mounting to both sides of the board. In addition to providing retention during processing, the holddowns are soldered during reflow and therefore provide long-term strain relief for the solder joints. AMPMODU 50/50 Grid Vertical Headers and Receptacles are designed to be compatible with standard surface-mount processes; IR (infrared) and VPR (vapor phase reflow). The surface-mount connectors have been designed so that dimensioning, tolerances, referenced datums, holddown characteristics and packaging methods result in a system that is compatible with robotic assembly. The headers and receptacles feature polarization to prevent misalignment. Three Board Stack Heights Non-Protrusive Metallic Holddowns .250±.006 [6.35±0.15] .320±.006 [8.13±0.15] .390±.006 [9.91±0.15] R R |
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