06/21/11

www.irf.com

1

AUIRFZ48Z

AUIRFZ48ZS

AUTOMOTIVE GRADE

PD - 97612A

Features

l

Advanced Process Technology

l

Ultra Low On-Resistance

l

175°C Operating Temperature

l

Fast Switching

l

Repetitive Avalanche Allowed up

to Tjmax

l

Lead-Free, RoHS Compliant

l

Automotive Qualified *

Description

Specifically designed for Automotive applications,

processing techniques to achieve extremely low

on-resistance per silicon area. Additional features

of this design are a 175°C junction operating

temperature, fast switching speed and improved

repetitive avalanche rating . These features com-

bine to make this design an extremely efficient and

reliable device for use in Automotive applications

and a wide variety of other applications.

G

D

S

Gate

Drain

Source

AUIRFZ48ZS

S

D

G

D

TO-220AB

AUIRFZ48Z

S

D

G

D

S

D

G

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are

stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the

specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.

*Qualification standards can be found at http://www.irf.com/

55V

11mΩ

61A

Parameter

Units

A

Pulsed Drain Current

c

Maximum Power Dissipation

W

Linear Derating Factor

W/°C

Gate-to-Source Voltage

V

Single Pulse Avalanche Energy (Thermally Limited)

d

mJ

Single Pulse Avalanche Energy Tested Value

i

Avalanche Current

c

A

Repetitive Avalanche Energy

h

mJ

dv/dt

Peak Diode Recovery dv/dt

e

V/ns

Operating Junction and

°C

Storage Temperature Range

Soldering Temperature, for 10 seconds (1.6mm from case )

Mounting torque, 6-32 or M3 screw

Thermal Resistance

Parameter

Typ.

Max.

Units

Junction-to-Case

k

–––

1.64

°C/W

Case-to-Sink, Flat, Greased Surface

0.50

–––

Junction-to-Ambient

–––

62

Junction-to-Ambient (PCB Mount, steady state)

j

–––

40

10 lbf•in (1.1N•m)

91

0.61

± 20

73

120

See Fig.12a,12b,15,16

300

-55 to + 175

7.2

Max.

61

43

240