RA4490LA08 datasheet(5/5 Pages) ETC2

Part #	RA4490LA08

Description	Solid State Relays Industrial, 1-Phase ZS, Standard Range

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Manufacturer	ETC2 [List of Unclassifed Manufacturers]

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Specifications are subject to change without notice (28.02.2007)

Applications

Thermal characteristics

The thermal design of Solid

State Relays is very impor-

tant. It is essential that the user

makes sure that cooling is ad-

equate and that the maximum

junction temperature of the re-

lay is not exceeded.

This relay is designed for use

in applications in which it is

exposed to high surge condi-

tions. Care must be taken to

ensure

proper

heatsinking

when the relay is to be used at

high sustained currents. Ade-

quate

electrical

connection

between relay terminals and

cable must be ensured.

RA 24.. .. 06, RA 44.. .. 08, RA 48.. .. 12

Heat flow

Heatsink

temperature

Rth j-c

Rth c-s

Rth s-a

Junction

temperature

Case

temperature

Ambient

temperature

Thermal resistance:

Rth j-c = junction to case

Direct bonding

In the design of the output

power semiconductor direct

bonding of the copper layer

and the ceramic substrate has

been applied. This is to en-

sure uninhibited heat transfer

and

high

thermal

fatigue

strength.

The relay has been designed

for applications requiring lar-

ge numbers of load cycles.

Power dissipation

The power dissipation for in-

termittent use is calculated ac-

cording to the following for-

mula:

ton

toff

OFF

ON

Irms =

ION2 x tON

tON + tOFF

Ex: RA 24 50 -D 06:

Load current = 45 A

tON = 30 s

t OFF = 15 s

Irms =

452 x 30

30 + 15

The rms current will be

36.7 A.

If the heatsink is placed in a

small closed room, control

panel or the like, the power

dissipation

can

cause

the

ambient temperature to rise.

The heatsink is to be cal-

culated on the basis of the

ambient temperature and the

increase in temperature.

Rth c-s = case to heatsink

Rth s-a = heatsink to ambient

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