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MCEEZW-P1-0000-0000H027F Datasheet(PDF) 10 Page - Cree, Inc |
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MCEEZW-P1-0000-0000H027F Datasheet(HTML) 10 Page - Cree, Inc |
10 / 14 page Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 10 xlamp mC-e leds notes lumen maintenance Projections Cree now uses standardized IeS Lm-80-08 and Tm-21-11 methods for collecting long-term data and extrapolating LeD lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/Lm80_results. moisture sensitivity XLamp mC-e LeDs are shipped in sealed, moisture-barrier bags (mBB) designed for long shelf life. If XLamp mC-e LeDs are exposed to moist environments after opening the mBB packaging but before soldering, damage to the LeD may occur during the soldering operation. The derating table at right defines the maximum exposure time (in days) for an XLamp mC-e LeD in the listed humidity and temperature conditions. LeDs with exposure time longer than the time specified below must be baked according to the baking conditions listed here. Cree recommends keeping XLamp LeDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LeDs to the resealable moisture-barrier bag and closing the bag immediately after use. baking conditions It is not necessary to bake all XLamp mC-e LeDs. only the LeDs that meet all of the following criteria must be baked: • LeDs that have been removed from the original mBB packaging. • LeDs that have been exposed to a humid environment longer than listed in the moisture Sensitivity section above. • LeDs that have not been soldered. LeDs should be baked at 80 ºC for 24 hours. LeDs may be baked on the original reels. Remove LeDs from mBB packaging before baking. Do not bake parts at temperatures higher than 80 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. storage conditions XLamp mC-e LeDs that have been removed from original mBB packaging but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 ± 5 ºC and no greater than 10% RH. For LeDs stored in these conditions, storage time does not add to exposure time as defined in the above Moisture Sensitivity section. rohs compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the product ecology section of www.cree.com. temperature maximum Percent relative humidity 30% 40% 50% 60% 70% 80% 90% 30 ºC 9 5 4 3 1 1 1 25 ºC 12 7 5 4 2 1 1 20 ºC 17 9 7 6 2 2 1 |
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