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©2013 Littelfuse, Inc.

Specifications are subject to change without notice.

Revision: July 17, 2013

SP3006 Series

Low Capacitance ESD Protection - SP3006 Series

Product Characteristics

Lead Plating

Pre-Plated Frame

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Substitute

Material

Silicon

Body Material

Molded Epoxy

Flammability

UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

Critical Zone

Reflow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp

(T

3°C/second max

T

3°C/second max

Reflow

-Temperature (T

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Part Numbering System

SP3006

TG

Series

Number of Channels

02 = 2 channel

Package

X = SOT563

T= Tape & Reel

G= Green

TVS Diode Arrays

02 X

Part Marking System

Product Series

1=SP3006 series

Assembly Site

(varies)

Number of Channels

(varies)

2

Ordering Information

Part Number

Package

Marking

Min. Order Qty.

SP3006-02XTG

SOT563

3000