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FOD852SD Datasheet(PDF) 7 Page - Fairchild Semiconductor |
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FOD852SD Datasheet(HTML) 7 Page - Fairchild Semiconductor |
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7 / 13 page  ©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD852 Rev. 1.2.2 7 Lead Free Recommended IR Reflow Condition Figure 16. Reflow Profile Recommended Wave Soldering Condition Profile Feature Pb-Sn solder assembly Lead Free assembly Preheat Conditions Temperature: Tsmin to Tsmax Time: tS 100°C to 150°C 60 to 120 seconds 150°C to 200°C 60 to 120 seconds Melt Soldering Zone 183°C 60 to 120 seconds 217°C 30 to 90 seconds Peak Temperature (Tp) 240 +0°C/-5°C 260 +0°C/-5°C Ramp-down Rate 6°C/s maximum 6°C/s maximum Profile Feature For all Solder Assembly Peak Temperature (Tp) Maximum 260°C for 10 seconds Time (sec) tS (Preheat) 25 °C Tsmin Tsmax Tp Soldering zone Ramp-down |
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