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OPA551UAE4 Datasheet(PDF) 11 Page - Texas Instruments |
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OPA551UAE4 Datasheet(HTML) 11 Page - Texas Instruments |
11 / 24 page OPA551, OPA552 11 SBOS100A www.ti.com power supplies, this creates an internal dissipation of 11.4W. This far exceeds the maximum rating and is not recom- mended. If operation in this region is unavoidable, use the DDPAK with a heat sink. HEAT SINKING Power dissipated in the OPA551 or OPA552 will cause the junction temperature to rise. For reliable operation, the junction temperature should be limited to +125 °C. Many applications will require a heat sink to assure that the maximum operating junction temperature is not exceeded. The heat sink required depends on the power dissipated and on ambient conditions. For heat sinking purposes, the tab of the DDPAK is typically soldered directly to a circuit board copper area. Increasing the copper area improves heat dissipation. Figure 6 shows typical thermal resistance from junction-to-ambient as a function of copper area. Depending on conditions, additional heat sinking may be required. Aavid Thermal Products Inc. manufactures sur- face-mountable heat sinks designed specifically for use with DDPAK packages. Further information is available on Aavid’s web site, www.aavid.com. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is activated. Use worst-case load and signal conditions. For good reliability, the thermal protec- tion should trigger more than +25 °C above the maximum expected ambient condition of your application. This pro- duces a junction temperature of +125 °C at the maximum expected ambient condition. FIGURE 5. DDPAK-7 Safe Operating Area. FIGURE 3. DIP-8 Safe Operating Area. FIGURE 4. SO-8 Safe Operating Area. FIGURE 6. DDPAK Thermal Resistance vs Circuit Board Copper Area. THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA 50 40 30 20 10 0 012345 Copper Area (inches2) OPA551, OPA552 Surface-Mount Package 1oz. copper Circuit Board Copper Area OPA551, OPA552 Surface-Mount Package 1000 100 10 1 0.1 1 10 100 | V S | – | VO | (V) SAFE OPERATING AREA—8-PIN DIP 125 °C 85 °C 25 °C 1000 100 10 1 0.1 1 10 100 | V S | – | VO | (V) SAFE OPERATING AREA—SO-8 125 °C 85 °C 25 °C 1000 100 10 1 0.1 1 10 100 | V S | – | VO | (V) SAFE OPERATING AREA—DDPAK 125 °C 125 °C 1" Copper 85 °C 25 °C 25 °C 1" Copper |
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