MTD1N50E

2

Motorola TMOS Power MOSFET Transistor Device Data

Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS

Drain–Source Breakdown Voltage

(VGS = 0 Vdc, ID = 0.25 µAdc)

Temperature Coefficient (Positive)

V(BR)DSS

500

—

—

480

—

—

Vdc

mV/

°C

Zero Gate Voltage Drain Current

(VDS = 500 Vdc, VGS = 0 Vdc)

(VDS = 500 Vdc, VGS = 0 Vdc, TJ = 125°C)

IDSS

—

—

—

—

10

100

µAdc

Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0)

IGSS

—

—

100

nAdc

ON CHARACTERISTICS (1)

Gate Threshold Voltage

(VDS = VGS, ID = 250 µAdc)

Temperature Coefficient (Negative)

VGS(th)

2.0

—

3.2

6.0

4.0

—

Vdc

mV/

°C

Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 0.5 Adc)

RDS(on)

—

4.3

5.0

Ohm

Drain–Source On–Voltage (VGS = 10 Vdc)

(ID = 1.0 Adc)

(ID = 0.5 Adc, TJ = 125°C)

VDS(on)

—

—

4.5

—

6.0

5.3

Vdc

Forward Transconductance (VDS = Vdc, ID = 0.5 Adc)

gFS

0.5

0.9

—

mhos

DYNAMIC CHARACTERISTICS

Input Capacitance

(VDS = 25 Vdc, VGS = 10 Vdc,

f = 1.0 MHz)

Ciss

—

215

315

pF

Output Capacitance

(VDS = 25 Vdc, VGS = 10 Vdc,

f = 1.0 MHz)

Coss

—

30.2

42

Reverse Transfer Capacitance

f = 1.0 MHz)

Crss

—

6.7

12

SWITCHING CHARACTERISTICS (2)

Turn–On Delay Time

(VDD = 250 Vdc, ID = 1.0 Adc,

VGS = 10 Vdc,

RG = 9.1 Ω)

td(on)

—

8.0

20

ns

Rise Time

(VDD = 250 Vdc, ID = 1.0 Adc,

VGS = 10 Vdc,

RG = 9.1 Ω)

tr

—

9.0

10

Turn–Off Delay Time

VGS = 10 Vdc,

RG = 9.1 Ω)

td(off)

—

14

30

Fall Time

G = 9.1 Ω)

tf

—

17

30

Gate Charge

(See Figure 8)

(VDS = 400 Vdc, ID = 1.0 Adc,

VGS = 10 Vdc)

QT

—

7.4

9.0

nC

(See Figure 8)

(VDS = 400 Vdc, ID = 1.0 Adc,

VGS = 10 Vdc)

Q1

—

1.6

—

(VDS = 400 Vdc, ID = 1.0 Adc,

VGS = 10 Vdc)

Q2

—

3.8

—

Q3

—

5.0

—

SOURCE–DRAIN DIODE CHARACTERISTICS

Forward On–Voltage (1)

(IS = 1.0 Adc, VGS = 0 Vdc)

(IS = 1.0 Adc, VGS = 0 Vdc, TJ = 125°C)

VSD

—

—

0.81

0.68

1.2

—

Vdc

Reverse Recovery Time

(See Figure 14)

(IS = 1.0 Adc, VGS = 0 Vdc,

dIS/dt = 100 A/µs)

trr

—

141

—

ns

(See Figure 14)

(IS = 1.0 Adc, VGS = 0 Vdc,

dIS/dt = 100 A/µs)

ta

—

82

—

(IS = 1.0 Adc, VGS = 0 Vdc,

dIS/dt = 100 A/µs)

tb

—

58.5

—

Reverse Recovery Stored Charge

QRR

—

0.65

—

µC

INTERNAL PACKAGE INDUCTANCE

Internal Drain Inductance

(Measured from contact screw on tab to center of die)

(Measured from the drain lead 0.25

″ from package to center of die)

LD

—

—

3.5

4.5

—

—

nH

Internal Source Inductance

(Measured from the source lead 0.25

″ from package to source bond pad)

LS

—

7.5

—

nH

(1) Pulse Test: Pulse Width

≤ 300 µs, Duty Cycle ≤ 2%.

(2) Switching characteristics are independent of operating junction temperature.