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XBP06V4E4GR-G Datasheet(PDF) 3 Page - Torex Semiconductor |
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XBP06V4E4GR-G Datasheet(HTML) 3 Page - Torex Semiconductor |
3 / 4 page 3/4 XBP06V4E4GR-G ● USP-4 Power Dissipation Board Mount (Tj max = 150℃) Ambient Temperature (℃) Power Dissipation Pd (mW) Thermal Resistance (℃/W) 25 1000 150 0 125.00 Power dissipation data for the USP-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. Evaluation Board (Unit: mm) 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area in top and back faces. Package heat-sink is tied to the copper traces. Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient temperature ■PACKAGING INFORMATION Pd-Ta特性グラフ 0 200 400 600 800 1000 1200 25 50 75 100 125 150 周囲温度Ta(℃) Pd vs. Ta Ambient Temperature: Ta (℃) |
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