2N7002KT3G datasheet(1/6 Pages) ONSEMI

Part #	2N7002KT3G

Description	Small Signal MOSFET 60 V, 380 mA, Single, N?묬hannel, SOT??3

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Manufacturer	ONSEMI [ON Semiconductor]

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February, 2013 − Rev. 11

1

Publication Order Number:

2N7002K/D

2N7002K, 2V7002K

Small Signal MOSFET

60 V, 380 mA, Single, N−Channel, SOT−23

Features

• ESD Protected

• Low RDS(on)

• Surface Mount Package

• 2V Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Applications

• Low Side Load Switch

• Level Shift Circuits

• DC−DC Converter

• Portable Applications i.e. DSC, PDA, Cell Phone, etc.

MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)

Rating

Symbol

Value

Unit

Drain−to−Source Voltage

VDSS

60

V

Gate−to−Source Voltage

VGS

±20

V

Drain Current (Note 1)

Steady State 1 sq in Pad

TA = 25°C

TA = 85°C

ID

380

270

mA

Drain Current (Note 2)

Steady State Minimum Pad

TA = 25°C

TA = 85°C

ID

320

230

mA

Power Dissipation

Steady State 1 sq in Pad

Steady State Minimum Pad

PD

420

300

mW

Pulsed Drain Current (tp = 10 ms)

IDM

1.5

A

Operating Junction and Storage

Temperature Range

TJ, TSTG

−55 to

+150

°C

Source Current (Body Diode)

IS

300

mA

Lead Temperature for Soldering Purposes

(1/8″ from case for 10 s)

TL

260

°C

Gate−Source ESD Rating

(HBM, Method 3015)

ESD

2000

V

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Surface−mounted on FR4 board using 1 sq in pad size with 1 oz Cu.

2. Surface−mounted on FR4 board using 0.08 sq in pad size with 1 oz Cu.

Device

Package

Shipping†

ORDERING INFORMATION

2N7002KT1G

3000 / Tape & Reel

SIMPLIFIED SCHEMATIC

SOT−23

CASE 318

STYLE 21

704 MG

G

MARKING DIAGRAM

& PIN ASSIGNMENT

3

2

1

Drain

Gate

2

1

3

Source

http://onsemi.com

SOT−23

(Pb−Free)

60 V

1.6 W @ 10 V

RDS(on) MAX

380 mA

ID MAX

V(BR)DSS

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

2.5 W @ 4.5 V

Gate

Source

Drain

3

2

1

(Top View)

704

= Specific Device Code*

M

= Date Code*

G

= Pb−Free Package

2V7002KT1G

3000 / Tape & Reel

SOT−23

(Pb−Free)

*Specific Device Code, Date Code or overbar

orientation and/or location may vary depend-

ing upon manufacturing location. This is a

representation only and actual devices may

not match this drawing exactly.

(Note: Microdot may be in either location)

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