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NCP699SN15T1G Datasheet(PDF) 2 Page - ON Semiconductor

Part # NCP699SN15T1G
Description  150 mA CMOS Low Iq LDO with Enable in TSOP-5
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP699SN15T1G Datasheet(HTML) 2 Page - ON Semiconductor

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NCP699
http://onsemi.com
2
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1
Vin
Positive power supply input voltage.
2
Gnd
Power supply ground.
3
Enable
This input is used to place the device into low−power standby. When this input is pulled low, the device is
disabled. If this function is not used, Enable should be connected to Vin.
4
N/C
No internal connection.
5
Vout
Regulated output voltage.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
Vin
2.1 to 6.0
V
Enable Voltage
Enable
−0.3 to Vin +0.3
V
Output Voltage
Vout
−0.3 to Vin +0.3
V
Power Dissipation
PD
Internally Limited
W
Operating Junction Temperature
TJ
+150
°C
Maximum Junction Temperature
TJ(max)
+150
°C
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
2. Latch−up capability (85°C) "200 mA DC with trigger voltage.
THERMAL CHARACTERISTICS
Rating
Symbol
Test Conditions
Typical Value
Unit
Junction−to−Ambient
RqJA
1 oz Copper Thickness, 100 mm2
250
°C/W
PSIJ−Lead 2
YJL2
1 oz Copper Thickness, 100 mm2
68
°C/W
NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following
boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.


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