300V Mini Family

Rev 8.8

vicorpower.com

Page 11 of 13

4/2013

800 735.6200

300V Input

Module 2

Module 1

Module N+1

+OUT

+S

SC

–S

–OUT

Load

+S

–S

+OUT

+S

SC

–S

–OUT

+OUT

+S

SC

–S

–OUT

Figure11—N+1modulearrayoutputconnections.

•

The +Out and –Out power buses should be designed to

minimize and balance parasitic impedance from each

module output to the load.

•

The +Sense pins must be tied together to form a

+Sense bus. This must be Kelvin connected to +Out

at a single point. The –Sense pins should be tied

together to form a –Sense bus. This must be Kelvin

connected to –Out at a single point.

•

At the discretion of the power system designer,

a subset of all modules within an array may be

configured as slaves by connecting SC to –S.

•

OR’ing diodes may be inserted in series with the

+Out pins of each module to provide module

output fault tolerance.

•

The +Sense and -Sense leads should be routed in close

proximity to each other on the printed circuit board. If

wires are used to connect the converters on a PCB to

an external load, the Sense leads should be twisted

together to reduce noise pickup.

Designator

Description

Finish

Notes

(None)

Short

Tin/Lead

Requires in-board, mounting

L

Long

Tin/Lead

On-board mounting for 0.065" boards

S

Short ModuMate

Gold

SurfMate or in-board socket mounting

N

Long ModuMate

Gold

On-board socket mounting

F

Short RoHS

Gold

Select for RoHS compliant in-board solder, socket, or SurfMate mounting

G

Long RoHS

Gold

Select for RoHS compliant on-board solder or socket mounting

* Pin style designator follows the “B” after the output power and precedes the baseplate designator.

Ex. V300B12T250B

N2—LongModuMatePins

PARALLELBUSOUTPUT

PIN STYLES*