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LMH6626MA Datasheet(PDF) 2 Page - Texas Instruments |
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LMH6626MA Datasheet(HTML) 2 Page - Texas Instruments |
2 / 31 page LMH6624 SNOSA42F – NOVEMBER 2002 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) ESD Tolerance Human Body Model 2000V (2) Machine Model 200V (3) VIN Differential ±1.2V Supply Voltage (V+ - V−) 13.2V Voltage at Input pins V+ +0.5V, V− −0.5V Soldering Information Infrared or Convection (20 sec.) 235°C Wave Soldering (10 sec.) 260°C Storage Temperature Range −65°C to +150°C Junction Temperature (4), (5) +150°C (1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) Human body model, 1.5k Ω in series with 100pF. (3) Machine Model, 0 Ω in series with 200pF. (4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. (5) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. Operating Ratings (1) Operating Temperature Range (2), (3) −40°C to +125°C Package Thermal Resistance ( θJA) (3) SOIC-8 166°C/W SOT23–5 265°C/W VSSOP-8 235°C/W (1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. (3) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. 2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMH6624 |
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