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SN65LBC179QDR Datasheet(PDF) 10 Page - Texas Instruments |
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SN65LBC179QDR Datasheet(HTML) 10 Page - Texas Instruments |
10 / 19 page SN75LBC179, SN65LBC179, SN65LBC179Q LOW POWER DIFFERENTIAL LINE DRIVER AND RECEIVER PAIRS SLLS173F − JANUARY 1994 − REVISED APRIL 2006 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 THERMAL CHARACTERISTICS − D PACKAGE PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Junction−to−ambient thermal reisistance, θJA† Low-K board, no air flow 199.4 Junction−to−ambient thermal reisistance, θJA† High-K board, no air flow 119 °C/W Junction−to−board thermal reisistance, θJB High-K board, no air flow 67 °C/W Junction−to−case thermal reisistance, θJC 46.6 Average power dissipation, P(AVG) RL = 54 Ω, input to D is 10 Mbps 50% duty cycle square wave, VCC = 5.25 V, TJ = 130 °C. 330 mW Thermal shutdown junction temperature, TSD 165 °C † See TI application note literature number SZZA003, Package Thermal Characterization Methodologies, for an explanation of this parameter. |
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