3

®

INA132

INA132P, U

INA132PA, UA

PARAMETER

CONDITIONS

MIN

TYP

MAX

MIN

TYP

MAX

UNITS

RTO

Initial

±150

±500

V

±750

µV

vs Temperature

±2

V

µV/°C

INPUT VOLTAGE RANGE

Common-Mode Voltage Range

0

2(V+)–2

VV

V

Common-Mode Rejection

76

90

70

V

dB

OUTPUT

Voltage, Positive

(V+)–1

(V+)–0.75

VV

V

Negative

+0.25

+0.06

VV

V

Positive

(V+)–1

(V+)–0.8

VV

V

Negative

+0.25

+0.12

VV

V

POWER SUPPLY

Rated Voltage

+5

V

V

Voltage Range

+2.7

+36

VV

V

Quiescent Current

±155

±185

VV

µA

VSpecifications the same as INA132P.

NOTE: (1) Include effects of amplifier’s input bias and offset currents.

PIN CONFIGURATION

TOP VIEW

DIP/SOIC

Ref

–In

+In

V–

No Internal Connection

V+

Output

Sense

1

2

3

4

8

7

6

5

Supply Voltage, V+ to V– .................................................................... 36V

Input Voltage Range ..........................................................................

±80V

Output Short-Circuit (to ground) .............................................. Continuous

Operating Temperature ................................................. –55

°C to +125°C

Storage Temperature ..................................................... –55

°C to +125°C

Junction Temperature .................................................................... +150

°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

ABSOLUTE MAXIMUM RATINGS

ORDERING INFORMATION

PACKAGE

DRAWING

TEMPERATURE

PRODUCT

PACKAGE

RANGE

INA132PA

8-Pin Plastic DIP

006

–40

°C to +85°C

INA132P

8-Pin Plastic DIP

006

–40

°C to +85°C

INA132UA

SO-8 Surface-Mount

182

–40

°C to +85°C

INA132U

SO-8 Surface-Mount

182

–40

°C to +85°C

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with ap-

propriate precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.