Electronic Components Datasheet Search |
|
TLV2221IDBVR Datasheet(PDF) 1 Page - Texas Instruments |
|
|
TLV2221IDBVR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 32 page TLV2221, TLV2221Y Advanced LinCMOS RAILTORAIL VERY LOW POWER SINGLE OPERATIONAL AMPLIFIERS SLOS157B − JUNE1996 − REVISED APRIL 2005 3−1 WWW.TI.COM D Output Swing Includes Both Supply Rails D Low Noise . . . 19 nV/√Hz Typ at f = 1 kHz D Low Input Bias Current ...1 pA Typ D Fully Specified for Single-Supply 3-V and 5-V Operation D Very Low Power ...110 µA Typ D Common-Mode Input Voltage Range Includes Negative Rail D Wide Supply Voltage Range 2.7 V to 10 V D Macromodel Included description The TLV2221 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a compromise between the ac performance and output drive of the TLV2231 and the micropower TLV2211. It consumes only 150 µA (max) of supply current and is ideal for battery-powered applications. The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The TLV2221 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications. The TLV2221, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). With a total area of 5.6mm2, the SOT-23 package only requires one third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage paths. The OUT and IN− terminals are on the same end of the board to provide negative feedback. Finally, gain setting resistors and decoupling capacitor are easily placed around the package. VI VDD+ OUT IN − VDD/GND IN + C RI RF GND V+ VO 1 2 3 4 5 Figure 1. Typical Surface Mount Layout for a Fixed-Gain Noninverting Amplifier Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DBV PACKAGE (TOP VIEW) 5 4 3 1 2 IN − VDD−/GND IN + VDD+ OUT PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 1997 −2005, Texas Instruments Incorporated Advanced LinCMOS is a trademark of Texas Instruments Incorporated. |
Similar Part No. - TLV2221IDBVR |
|
Similar Description - TLV2221IDBVR |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |