 Semiconductor Components Industries, LLC, 2012

February, 2012 − Rev. 10

1

Publication Order Number:

ESD5Z2.5T1/D

ESD5Z2.5T1G Series,

SZESD5Z2.5T1G Series

Transient Voltage

Suppressors

Micro−Packaged Diodes for ESD Protection

The ESD5Z Series is designed to protect voltage sensitive components

from ESD and transient voltage events. Excellent clamping capability,

low leakage, and fast response time, make these parts ideal for ESD

protection on designs where board space is at a premium. Because of its

small size, it is suited for use in cellular phones, portable devices, digital

cameras, power supplies and many other portable applications.

Specification Features:

0.047 x 0.032 (1.20 mm x 0.80 mm)

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

Mechanical Characteristics:

CASE:

Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH:

100% Matte Sn (Tin)

MOUNTING POSITION:

Any

QUALIFIED MAX REFLOW TEMPERATURE:

260C

Device Meets MSL 1 Requirements

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Device

Package

ORDERING INFORMATION

SOD−523

CASE 502

PLASTIC

STYLE 1

1

Cathode

2

Anode

MARKING DIAGRAM

See specific marking information in the device marking

column of the Electrical Characteristics tables starting on

page 3 of this data sheet.

DEVICE MARKING INFORMATION

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

http://onsemi.com

XX = Specific Device Code

M

= Date Code

G

= Pb−Free Package

XX

1

2

G

(Note: Microdot may be in either location)

ESD5ZxxxT1G

SOD−523

Pb−Free

3,000 /

Tape & Reel

*Date Code orientation may vary

depending upon manufacturing location.

SZESD5ZxxxT1G

SOD−523

Pb−Free

3,000 /

Tape & Reel