Revision: C

2/28/2013

Sheet 11 of 13

©2013 Knowles Electronics

SPM0423HE4H-WB

12. ADDITIONAL NOTES

(A) MSL (moisture sensitivity level) Class 1.

(B) Maximum of 3 reflow cycles is recommended.

(C) In order to minimize device damage:

 Do not board wash or clean after the reflow process.

 Do not brush board with or without solvents after the reflow process.

 Do not directly expose to ultrasonic processing, welding, or cleaning.

 Do not insert any object in port hole of device at any time.

 Do not apply over 30 psi of air pressure into the port hole.

 Do not pull a vacuum over port hole of the microphone.

 Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.

13. MATERIALS STATEMENT

Meets the requirements of the European RoHS directive, 2011/65/EC as amended.

Meets the requirements of the industry-standard IEC 61249-2-21:2003 for halogenated

substances and Knowles Green Materials Standards Policy section on Halogen-Free.

Ozone depleting substances are not used in the product or the processes used to make the

product including compounds listed in annex A, B, and C of the “Montreal Protocol on

Substances that deplete the ozone Layer.”