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TPS2834DRG4 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS2834DRG4 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 23 page TPS2834, TPS2835 SYNCHRONOUSBUCK MOSFET DRIVERS WITH DEADTIME CONTROL SLVS223B − NOVEMBER 1999 − REVISED AUGUST 2002 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 detailed description (continued) SYNC The SYNC terminal controls whether the drivers operate in synchronous or nonsynchronous mode. In synchronous mode, the low-side FET is operated as a synchronous rectifier. In nonsynchronous mode, the low-side FET is always off. SYNC is a TTL-compatible digital terminal. CROWBAR The CROWBAR terminal overrides the normal operation of the driver. When CROWBAR is low, the low-side FET turns on to act as a clamp, protecting the output voltage of the dc/dc converter against overvoltages due to a short across the high-side FET. VIN should be fused to protect the low-side FET. CROWBAR is a TTL-compatible digital terminal. absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage range, VCC (see Note 1) −0.3 V to 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage range: BOOT to PGND (high-side driver ON) −0.3 V to 30 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BOOTLO to PGND −0.3 V to 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BOOT to BOOTLO −0.3 V to 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ENABLE, SYNC, and CROWBAR −0.3 V to 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN −0.3 V to 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DT −0.3 V to 30 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating virtual junction temperature range, TJ −40 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds 260 °C . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: Unless otherwise specified, all voltages are with respect to PGND. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C PWP with solder‡ 2668 26.68 mW/ °C 1467 1067 PWP without solder‡ 1024 10.24 mW/ °C 563 409 D 749 7.49 mW/ °C 412 300 JUNCTION-CASE THERMAL RESISTANCE TABLE PWP Junction-case thermal resistance 2.07 °C/W ‡ Test Board Conditions: 1. Thickness: 0.062 I 2. 3 I × 3I (for packages <27 mm long) 3. 4 I × 4I (for packages >27 mm long) 4. 2-oz copper traces located on the top of the board (0.071 mm thick) 5. Copper areas located on the top and bottom of the PCB for soldering 6. Power and ground planes, 1-oz copper (0.036 mm thick) 7. Thermal vias, 0.33 mm diameter, 1.5 mm pitch 8. Thermal isolation of power plane For more information, refer to TI technical brief literature number SLMA002. |
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