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TLE2021AIP Datasheet(PDF) 4 Page - Texas Instruments |
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TLE2021AIP Datasheet(HTML) 4 Page - Texas Instruments |
4 / 77 page TLE202x, TLE202xA, TLE202xB, TLE202xY EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLE2021Y chip information This chip, when properly assembled, display characteristics similar to the TLE2021. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax= 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + − OUT IN + IN − VCC+ (7) (3) (2) (6) (4) VCC−/GND (1) (5) OFFSET N1 OFFSET N2 78 54 (1) (2) (3) (4) (5) (6) (7) |
Similar Part No. - TLE2021AIP |
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Similar Description - TLE2021AIP |
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