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MCU0805ME0BPW00 Datasheet(PDF) 8 Page - Vishay Siliconix |
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MCU0805ME0BPW00 Datasheet(HTML) 8 Page - Vishay Siliconix |
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8 / 9 page  MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Precision Thin Film Chip Resistor Superior Moisture Resistivity Vishay Beyschlag Document Number: 28785 For technical questions, contact: filmresistors.thinfilmchip@vishay.com www.vishay.com Revision: 09-Apr-09 8 4.37 - Periodic electric overload; standard operation mode U = ≤ 2 x U max.; 0.1 s on; 2.5 s off; 1000 cycles ± (0.5 % R +0.05 Ω) 4.40 - ESD (Electro Static Discharge) IEC 61340-3-1; 3 pos. + 3 neg. (equivalent to MIL-STD-883, Method 3015) MCT 0603 AT: 1000 V MCU 0805 AT: 1500 V MCA 1206 AT: 2000 V ± (0.5 % R +0.05 Ω) 4.22 6 (Fc) Vibration Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude ≤ 1.5 mm or ≤ 200 m/s2; 6 h ± (0.05 % R +0.01 Ω) no visible damage 4.17.2 58 (Td) Solderability Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s Good tinning ( ≥ 95 % covered); no visible damage Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux; (235 ± 3) °C; (2 ± 0.2) s Good tinning ( ≥ 95 % covered); no visible damage 4.18.2 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ± (0.05 % R +0.01 Ω) no visible damage 4.29 45 (XA) Component solvent resistance Isopropyl alcohol + 50 °C; method 2 No visible damage 4.32 21 (Ue3) Shear (adhesion) RR 1608M; 9 N No visible damage RR 2012M and RR 3216M; 45 N 4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± (0.05 % R +0.01 Ω) no visible damage; no open circuit in bent position 4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown 4.35 - Flammability Needle flame test; 10 s No burning after 30 s TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE ( ΔR) STABILITY CLASS 0.25 OR BETTER (1) Stability for product types: MCT 0603 AT 47 Ω to 100 kΩ MCU 0805 AT 47 Ω to 100 kΩ MCA 1206 AT 47 Ω to 100 kΩ 15 x P 70 x R |
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