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MCFT000111 Datasheet(PDF) 7 Page - List of Unclassifed Manufacturers

Part # MCFT000111
Description  Wire Wound Chip Inductor
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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MCFT000111 Datasheet(HTML) 7 Page - List of Unclassifed Manufacturers

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www.element14.com
www.farnell.com
www.newark.com
Page <7>
V1.0
18/07/12
Wire Wound Chip Inductor
MCFT02 Wire Wound Chip Inductors / High SRF Type
Electrical Performance Test
Item
Requirement
Test Method
Inductance
Refer to standard electrical
characteristic spec.
HP4286
Q
HP4286
SRF
HP4287
DC Resistance RDC
Micro-Ohm meter (Gom-801G)
Rated Current IDC
Applied the current to coils, The inductance change should 
be less than 10% to initial value
Over Load
Inductors shall have no evidence
of electrical and mechanical
damage
Applied 2 times of rated allowed DC current to inductor for
a period of 5 minutes
Withstanding Voltage
Inductors shall be no evidence
of electrical and mechanical
damage.
AC voltage of 500 VAC applied between inductors terminal
and case for 1 min.
Insulation Resistance
1,000MΩ min.
100 VDC applied between inductor terminal and case
27
±2%, ±3%, ±5%, ±10%
250
62
86
3.2
0.275
450
33
±2%, ±3%, ±5%, ±10%
250
61
80
2.8
0.33
490
39
±2%, ±3%, ±5%, ±10%
250
56
84
2.6
0.43
450
47
±2%, ±3%, ±5%, ±10%
250
48
62
2.4
0.58
420
Item
Requirement
Test Method
Vibration
Appearance: No damage
L change: within ±5%
Q change: within ±10%
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1 min.
Amplitude: 1.5 mm
Time: 2 hrs for each axis (X, Y &Z), total 6 hrs
Resistance to Soldering
Heat
Solder Temperature: 260±5°C
Immersion Time: 10±2 seconds
Component Adhesion
(Push Test)
1 lbs. For 0402
2 lbs. For 0603
3 lbs. For the rest
The device should be soldered (260±5 for 10 seconds) to a
tinned copper subs rate. A dynamiter force gauge should be
applied to the side of the component. The device must with
stand a minimum force of 2 or 4 pounds without a failure of
adhesion on termination
Drop
No damage
Dropping chip by each side and each corner. Drop 10 times
in total
Drop height: 100 cm
Drop weight: 125 g
Solderability
90% covered with solder
Inductor shall be dipped in a melted solder bath at 245±5
for 3 seconds
Resistance to Solvent
No damage on appearance and
marking
MIL-STD-202F, Method 215D
Mechanical Performance Test


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