PAGE

3

OF

7

TITLE :

台達電子工業股份有限公司

台達電子工業股份有限公司

台達電子工業股份有限公司

台達電子工業股份有限公司

Delta Electronics, Inc.

DOCUMENT

NO.

SMJ60000NH

PAGE

REV.

A2

THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF Delta Electronics, Inc.

AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION

UNLESS OTHERWISE SPECIFIED TOLERANCES ON ﹕

X

= ±

X.X

= ±

X.XX

= ±

ANGLES ±

HOLE DIA. ±

SCALE :

UNIT :

The Engineering Spec. For 1W 1206

Low Resistance Chip Resistor

5. Characteristics

Test Item

Condition of Test

Requirements

Short Time Overload

2.5 * rated power for 5 seconds

Refer to JIS C 5201-1 4.13

∆R : ± 0.5%

Without significant damage by

flashover ( spark, arching ), burning

or breakdown etc.

Insulation Resistance

The resistor shall be cramped in the

metal block and tested , as shown below.

Test voltage : 100

± 15V

Refer to JIS C 5201-1 4.6 Mounting

condition G.

Between Electrode and Protection

Film 100M

Ω or over

Between Electrode and Substrate

1,000M

Ω or over

Voltage Proof

Refer to JIS C 5201-1 4.7

∆R : ± 0.5%

Without damage by flashover, fire

or breakdown, as shown below.

Thermal Shock

-55 ~155℃ 100 cycles, 15 min at each

extreme condition

Refer to JIS C 5201-1 4.19

∆R : ± 1.0%

Without distinct damage in

appearance

Low Temperature Storage

Kept at -55℃, 1,000 hours

Refer to JIS C 5201-1 4.23.4

∆R : ± 1.0%

Without distinct damage in

appearance

High Temperature Exposure

Kept at 170℃ for 1,000 hours

Refer to JIS C 5201-1 4.23.2

∆R : ± 1.0%

Without distinct damage in

appearance

Solderability

Temperature of Solder : 245

± 5℃

Immersion Duration : 3

± 0.5 second

Refer to JIS C 5201-1 4.17

Uniform coating of solder cover

minimum of 95% surface being

immersed

Resistance to Soldering Heat

Dipped into solder at 270

± 5℃

for 10

± 1 seconds

Refer to JIS C 5201-1 4.18

∆R : ± 0.5%

Without distinct deformation in

appearance