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ADG726BSUZ Datasheet(PDF) 6 Page - Analog Devices |
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ADG726BSUZ Datasheet(HTML) 6 Page - Analog Devices |
6 / 12 page REV. 0 –6– ADG726/ADG732 PIN CONFIGURATIONS LFCSP and TQFP PIN 1 INDICATOR TOP VIEW ADG732 S12 S11 S10 S9 S8 S7 S6 S5 S4 S3 S2 S1 NC = NO CONNECT 36 S28 35 S27 34 S26 33 S25 32 S24 31 S23 30 S22 29 S21 28 S20 27 S19 26 S18 25 S17 1 2 3 4 5 6 7 8 9 10 11 12 PIN 1 INDICATOR TOP VIEW ADG726 1 S12A 2 S11A 3 S10A 4 S9A 5 S8A 6 S7A 7 S6A 8 S5A 9 S4A 10 S3A 11 S2A 12 S1A NC = NO CONNECT 36 S12B 35 S11B 34 S10B 33 S9B 32 S8B 31 S7B 30 S6B 29 S5B 28 S4B 27 S3B 26 S2B 25 S1B ABSOLUTE MAXIMUM RATINGS 1 (TA = 25 °C, unless otherwise noted.) VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –7 V Analog Inputs 2 . . . . . . . . . . . . . . V SS – 0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First Digital Inputs 2 . . . . . . . . . . . . . . . . . . –0.3 V to V DD + 0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 mA (Pulsed at 1 ms, 10% Duty Cycle Max) Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . . –40 °C to +85°C CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG726/ADG732 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150 °C Thermal Impedence (Four-layer board) 48-Lead LFCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 C/W 48-Lead TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . 54.6 C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300 °C IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2Overvoltages at A, EN, WR, CS, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. WARNING! ESD SENSITIVE DEVICE ORDERING GUIDE Model Temperature Range Package Description Package Option ADG726BCP –40 °C to +85°CChip Scale Package (LPCSP) CP-48 ADG726BSU –40 °C to +85°CThin Quad Flatpack (TQFP) SU-48 ADG732BCP –40 °C to +85°CChip Scale Package (LPCSP) CP-48 ADG732BSU –40 °C to +85°CThin Quad Flatpack (TQFP) SU-48 |
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