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XFL4020-102ME Datasheet(PDF) 2 Page - Analog Devices |
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XFL4020-102ME Datasheet(HTML) 2 Page - Analog Devices |
2 / 28 page ADP5037 Data Sheet Rev. D | Page 2 of 28 TABLE OF CONTENTS Features .............................................................................................. 1 Applications....................................................................................... 1 General Description ......................................................................... 1 Typical Application Circuit ............................................................. 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 General Specifications ................................................................. 3 BUCK1 and BUCK2 Specifications ........................................... 4 LDO1 and LDO2 Specifications................................................. 4 Input and Output Capacitor, Recommended Specifications.. 5 Absolute Maximum Ratings............................................................ 6 Thermal Resistance ...................................................................... 6 ESD Caution.................................................................................. 6 Pin Configuration and Function Descriptions............................. 7 Typical Performance Characteristics ............................................. 8 Theory of Operation ...................................................................... 15 Power Management Unit........................................................... 15 BUCK1 and BUCK2 .................................................................. 17 LDO1 and LDO2........................................................................ 18 Applications Information .............................................................. 19 Buck External Component Selection....................................... 19 LDO External Component Selection....................................... 21 Power Dissipation and Thermal Considerations ....................... 22 Buck Regulator Power Dissipation .......................................... 22 Junction Temperature ................................................................ 23 PCB Layout Guidelines.................................................................. 24 Typical Application Schematics.................................................... 25 Bill of Materials............................................................................... 26 Outline Dimensions....................................................................... 27 Ordering Guide .......................................................................... 27 REVISION HISTORY 5/13—Rev. C to Rev. D Added Table 1; Renumbered Sequentially .................................... 1 Changes to Figure 1.......................................................................... 1 Changes to NC Pin Description ..................................................... 7 Changes to Figure 48...................................................................... 18 Changes to Figure 50...................................................................... 20 Changes to Figure 52 and Figure 53............................................. 25 1/13—Rev. B to Rev. C Changes to Figure 9.......................................................................... 9 Changes to Ordering Guide .......................................................... 27 8/12—Rev. A to Rev. B Changes to Regulator Accuracy, Features Section ....................... 1 Changes to Output Voltage Accuracy, Table 2 and Voltage Feedback, Table 2.............................................................................. 4 Changes to Output Voltage Accuracy, Table 3 and Voltage Feedback, Table 3.............................................................................. 4 Changes to Figure 6, Figure 7, and Figure 8.................................. 8 Changes to Figure 9 to Figure 14.................................................... 9 Changes to Figure 30 and Figure 31............................................. 12 Changes to Figure 34 and Figure 38 Caption ............................. 13 Changes to Undervoltage Lockout Section................................. 16 Moved Power Dissipation and Thermal Considerations Section.............................................................................................. 22 Changes to Buck Regulator Power Dissipation Section............ 22 Changes to PCB Layout Guidelines Section............................... 24 Changes to Ordering Guide.......................................................... 27 1/12—Rev. 0 to Rev. A Changes to Features Section and Figure 1 .....................................1 Changes to Table 2 and Table 3........................................................4 Changes to Table 4.............................................................................5 Changes to Table 5.............................................................................6 Changes to Table 7.............................................................................7 Changes to Figure 34...................................................................... 13 Changes to Buck Regulator Power Dissipation Section............ 15 Changes to Undervoltage Lockout Section................................. 18 Changes to LDO1 and LDO2 Section ......................................... 20 Changes to Table 9.......................................................................... 22 Changes to Figure 52 and Figure 53 ............................................ 25 Changes to Ordering Guide.......................................................... 27 8/11—Revision 0: Initial Version |
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