II. Manufacturing Information

MAX17108ETI+

A. Description/Function:

10-Channel High-Voltage Scan Driver and VCOM Amplifier for TFT LCD

Panels

B. Process:

S45URS

C. Number of Device Transistors:

2918

D. Fabrication Location:

Texas

E. Assembly Location:

UTL Thailand

F. Date of Initial Production:

October 21, 2008

III. Packaging Information

A. Package Type:

28-pin TQFN 5x5

B. Lead Frame:

Copper

C. Lead Finish:

100% matte Tin

D. Die Attach:

Conductive Epoxy

E. Bondwire:

Au (1.0 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

#

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity per

JEDEC standard J-STD-020-C

Level 1

J. Single Layer Theta Ja:

47°C/W

K. Single Layer Theta Jc:

2.1°C/W

L. Multi Layer Theta Ja:

29°C/W

M. Multi Layer Theta Jc:

2.1°C/W

IV. Die Information

A. Dimensions:

60 X 128 mils

B. Passivation:

C. Interconnect:

Aluminum/0.5% Cu

D. Backside Metallization:

None

E. Minimum Metal Width:

Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)

F. Minimum Metal Spacing:

Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

I. Die Separation Method:

Wafer Saw

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