Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Anti-Surge Thick Film Chip Resistors

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Thick Film

Chip Resistors

Product Code

Size, Power Rating

Type: inch

P03 : 0603

P06 : 0805

P08 : 1206

P14 : 1210

Power R.

0.2 W

0.25 W

0.33 W

0.5 W

Resistance Tolerance

Code

D

F

J

Tolerance

± 0.5 %

± 1 %

± 5 %

The first two or three digits are significant figures

of resistance and the third or 4th one denotes

number of zeros following.

Three digit type (±5%),

four digit type (±1%, ±0.5%)

Example: 222

2.2 k , 1002

10 k

Resistance Value

Packaging Methods

Code

V

U

Type

ERJP03

ERJP06

ERJP08

ERJP14

Packaging

Punched Carrier Taping

4 mm pitch, 5,000 pcs.

Embossed Carrier Taping

4 mm pitch, 5,000 pcs.

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Thick Film

Chip Resistors

Product Code

Size, Power Rating

Type: inch

P6W : 0805

Power R.

0.5 W

Resistance Tolerance

Code

F

J

Tolerance

± 1 %

± 5 %

The first two or three digits are significant figures of resistance

and the third or 4th one denotes number of zeros following.

Three digit type (±5%), four digit type (±1%)

Example: 222

2.2 k , 1002

10 k

Resistance Value

Packaging Methods

Code

V

Packaging

Punched Carrier Taping

4 mm pitch, 5,000 pcs.

Anti-Surge Thick Film Chip Resistors

0603, 0805, 1206, 1210, 0805

Type:

ERJ P03, P06, P08, P14

ERJ P6W

● ESD surge characteristics superior to standard metal film resistors

● High reliability

Metal glaze thick film resistive element and three layers of electrodes

● Suitable for both reflow and flow soldering

● High power…0.2 W : 1608(0603) size(ERJP03)

0.25 W : 2012(0805) size(ERJP06)

0.33 W : 3216(1206) size(ERJP08)

0.5 W : 3225(1210) size(ERJP14), double-sided resistive elements structure 2012(0805) size(ERJP6W)

● Reference Standards…IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B

● RoHS compliant

■ Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions

Please see Data Files

Aug. 2012

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