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APL5101 Datasheet(PDF) 9 Page - Anpec Electronics Coropration |
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APL5101 Datasheet(HTML) 9 Page - Anpec Electronics Coropration |
9 / 18 page Copyright © ANPEC Electronics Corp. Rev. A.5 - Jul., 2013 APL5101/2 www.anpec.com.tw 9 Application Information Capacitor Selection and Regulation Stability The APL5101/2 use at least a 1 µF capacitor on the input. This capacitor can use Aluminum, Tantalum or Ceramic capacitors. Input capacitor with large value and low ESR provides better PSRR and line transient response. The output capacitor also can use Aluminum, Tantalum or Ceramic capacitor, and its proper values is recommended 1 µF, ESR must be above 10mΩ Large output capacitor values can reduce noise and improve load-transient response, stability, and PSRR. W ith X5R and Y5V dielectrics, 1 µF is sufficient at all operating temperatures. The selection of output capacitor is important because it with COUT forms a zero to provide the sufficient phase margin. Input-Output (Dropout) Voltage The minimum input-output voltage differential (dropout) determines the lowest usable supply voltage. The drop- out voltage is the function of drain-to-source on resis- tance multiplied by the load current. Current Limit and Short Circuit APL5101/2 include a current-limit circuitry for this lin- ear regulator. The current limit protection, which sense the current flows the P-channel MOSFET, and controls the output voltage. The point where limiting occurs is I OUT=30 0mA. W hen o utput is sh orted to gr ound, the APL5101/2 will keep short circuit current at 50mA.This design is a method for an indefinite amount of time with- out damaging to the part. Thermal Protection Thermal protection limits total power dissipation in the APL5101/2. When the junction temperature exceeds T J = +135 °C, the thermal sensor generate a logic signal to turn off the pass transistor and let IC to cool. When the IC’s junction temperature cools by 20 °C, the thermal sen- sor will turn the pass transistor on again, resulting in a pulsed output during continuous thermal protection. Ther- mal protection is designed to protect the IC in the event of fault conditions. For continual operation, the junction tem- perature do not exceed T J=+125 oC. Operating Region and Power Dissipation The thermal resistance of the case and circuit board, ambient and junction air temperature, and the rate of air flow all control the APL5101/2’s maximum power dissipation. The power dissipation across the device is P = I OUT (VIN-VOUT). The maximum power dissipation is: P MAX = (TJ-TA) / (θJC +θCA ) where T J-TA is the temperature difference between the junction and ambient air. θ JC is the thermal resistance of the package, θ CA is the thermal resistance through the printed circuit board, copper traces, and other materials to the surrounding air. The GND pin provides an electrical connection to ground and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissi- pates most of the heat into ambient air. Recommanded Minimum Footprint SOT-23 0.024 0.037 0.074 Unit : Inch 0.02 0.038 0.076 Unit : Inch SOT-23-5 |
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