Electronic Components Datasheet Search |
|
APL5601 Datasheet(PDF) 10 Page - Anpec Electronics Coropration |
|
APL5601 Datasheet(HTML) 10 Page - Anpec Electronics Coropration |
10 / 18 page Copyright © ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 www.anpec.com.tw 10 APL5601/5602 Application Information Layout Consideration Figure 1 illustrates the layout. Below is a checklist for your layout: 1. Please place the input capacitors close to the VIN. 2. Ceramic capacitors for load must be placed near the load as close as possible. 3. To place APL5601/5602 and output capacitors near the load is good for performance. 4. Large current paths, the bold lines in figure 1, must have wide tracks. Input Capacitor The APL5601/5602 require proper input capacitors to supply surge current during stepping load transients to prevent the input rail from dropping. Because the para- sitic inductor from the voltage sources or other bulk ca- pacitors to the VIN limits the slew rate of the surge current, it is necessary to place the input capacitors near VIN as close as possible. Input capacitors should be larger than 0.82 µF. Output Capacitor The APL5601/5602 need a proper output capacitor to maintain circuit stability and to improve transient response over temperature and current. In order to insure the cir- cuit stability, the proper output capacitor value should be larger than 1 µF. With X5R and X7R dielectrics, 2.2µF is sufficient at all operating temperatures. Maximum output capacitor should be less than 330 µF to insure the sys- tem can be powered on successfully. The APL5601/5602 maximum power dissipation de- pends on the thermal resistance and temperature differ- ence between the die junction and ambient air. The power dissipation P D across the device is: P D = (TJ - TA) / θJA where (T J-TA) is the temperature difference between the junction and ambient air. θ JA is the thermal resistance between junction and ambient air. Assuming the T A=25 oC, maximum T J=150 oC (typical thermal limit threshold) and θ JA=260 oC/W (SOT-23-3), so the maximum power dissi- pation is calculated as: Operation Region and Power Dissipation Figure 1. Recommended Minimum Footprint 0.038 0.091 0.126 Unit : Inch SOT-223 P D(max)=(150-25)/260 = 0.48(W) For normal operation, do not exceed the maximum oper- ating junction temperature of T J=125 oC. The calculated power dissipation should be less than: The pin 3 of the SOT-23 and the tabs (and pin 2) of the SOT-89 and SOT-223 provide an electrical connections and channel heat away. Connect the pins and tabs to a large area copper plane on PCBs for better heat dissipation. P D =(125-25)/260 = 0.38(W) 0.022 0.059 0.076 Unit : Inch SOT-89 0.0001 0.001 0.01 0.1 1 10 100 1 10 100 1000 Output Capacitor( µF) Stable region Instable region Untested VIN VOUT GND APL5601/5602 C IN C OUT V IN V OUT |
Similar Part No. - APL5601 |
|
Similar Description - APL5601 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |