Copyright

© ANPEC Electronics Corp.

Rev. A.6 - Mar., 2011

www.anpec.com.tw

3

APL5603

Note 3: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink

values. The junction-to-ambient thermal resistance is measured on a PC board mounting with the device soldered down to minimum

copper area. If power dissipation causes the junction temperature to exceed specified limits, the device will go into thermal

shutdown.

Note 4: The maximum allowable power dissipation at any T

Exceeding the maximum allowable power dissipation will result in excessive die temperature.

Symbol

Parameter

Range

Unit

VIN to GND

2.9 to 6

V

Output Current

0 to 0.6

A

Input Capacitor

0.82 to 470

µF

Output Capacitor

1 to 330

µF

Junction Temperature

-40 to 125

°C

Ambient Temperature

-40 to 85

°C

Electrical Characteristics

APL5603

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

SUPPLY CURRENT

-

-

1

µA

Quiescent Current

-

140

200

µA

UNDER-VOLTAGE-LOCKOUT

VIN UVLO Threshold

2.1

2.5

2.9

V

VIN UVLO Hysteresis

-

0.15

-

V

OUTPUT VOLTAGE

°C

-1

-

+1

Output Voltage

°C (T

°C)

-2

-

+2

Line Regulation

-

0.03

0.19

%/V

Load Regulation

-

0.6

1.5

%/A

-

240

500

-

220

450

Dropout Voltage

-

200

420

mV

PSRR

Power Supply Ripple Rejection

-

55

-

dB

Recommended Operating Conditions

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction to Air Thermal Resistance

SOT-23-5

TSOT-23-5

SOP-8

DFN3x3-8

260

260

150

110

°C/W

Refer to the typical application circuit. V

T

, unless otherwise specified. Typical values are at T