Copyright

© ANPEC Electronics Corp.

Rev. A.7 - Jun., 2008

APW7037A/B

www.anpec.com.tw

11

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness

Volume mm

3

<350

Volume mm

3

350-2000

Volume mm

3

>2000

<1.6 mm

260 +0

°C*

260 +0

°C*

260 +0

°C*

1.6 mm – 2.5 mm

260 +0

°C*

250 +0

°C*

245 +0

°C*

≥2.5 mm

250 +0

°C*

245 +0

°C*

245 +0

°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the

stated classification temperature (this means Peak reflow temperature +0

°C. For example 260°C+0°C)

at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness

Volume mm

3

<350

Volume mm

3

≥350

<2.5 mm

240 +0/-5

°C

225 +0/-5

°C

≥2.5 mm

225 +0/-5

°C

225 +0/-5

°C

Classification Reflow Profiles (Cont.)

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