Copyright

© ANPEC Electronics Corp.

Rev. A.7 - Nov., 2012

APW7073

www.anpec.com.tw

2

Pin Configuration

Symbol

Parameter

Rating

Unit

VCC, PVCC to GND

-0.3 to +16

V

BOOT to PHASE

-0.3 to +16

V

UGATE to PHASE <400ns pulse width

>400ns pulse width

V

LGATE to PGND

<400ns pulse width

>400ns pulse width

V

PHASE to GND

<400ns pulse width

>400ns pulse width

-10 to +30

-0.3 to 16

V

RT, OCSET, EN to GND

V

FB, COMP, SS to GND

-0.3 to 7

V

PGND to GND

-0.3 to +0.3

V

Junction Temperature Range

-20 to 150

°C

Storage Temperature

-65 to 150

°C

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Thermal Resistance in Free Air

SOP-14

160

Symbol

Parameter

Rating

Unit

IC Supply Voltage

10.8 to 13.2

V

Converter Input Voltage

2.2 to 13.2

V

Converter Output Voltage

0.6 to 5

V

Converter Output Current

0 to 30

A

Ambient Temperature Range

-20 to 70

°C

Junction Temperature Range

-20 to 125

°C

Recommended Operating Conditions

GND 7

FB 5

OCSET 2

8 PHASE

SS 3

EN 6

COMP 4

14 VCC

10 BOOT

13 PVCC

9 UGATE

12 LGATE

11 PGND

RT 1

SOP-14

Note2:

θ

exposed pad of package is soldered directly on the PCB.

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under

"recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods

may affect device reliability.