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APW7153KAI-TRG Datasheet(PDF) 2 Page - Anpec Electronics Coropration |
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APW7153KAI-TRG Datasheet(HTML) 2 Page - Anpec Electronics Coropration |
2 / 20 page Copyright © ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 APW7153/A/B www.anpec.com.tw 2 Symbol Parameter Rating Unit VVDD, VPVDD Input Supply Voltage -0.3 ~ 6 V >20ns pulse width -1 ~VPVDD+0.3 V VLX LX to GND Voltage <20ns pulse width -3 ~VPVDD+3 V SHDN/RT, FB, COMP, POK to GND Voltage -0.3 ~ 6 V PGND PGND to GND Voltage -0.3 ~ +0.3 V PD Power Dissipation Internally Limited W TJ Junction Temperature 150 oC TSTG Storage Temperature -65 ~ 150 oC TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 oC Ordering and Marking Information Absolute Maximum Ratings (Note 1) Thermal Characteristics Symbol Parameter Typical Value Unit θ JA Junction-to-Ambient Resistance in Free Air (Note 2) TDFN3x3-10 SOP-8P 50 80 oC/W θ JC Junction-to-Case Resistance in Free Air (Note 3) TDFN3x3-10 SOP-8P 10 20 oC/W Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 2: θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad of TDFN3x3-10 and SOP-8P is soldered directly on the PCB. Note 3: The case temperature is measured at the center of the exposed pad on the underside of the TDFN3x3-10 and SOP-8P packages. Package Code QB : TDFN3x3-10 KA : SOP-8P Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APW7153/A/B QB: APW 7153 XXXXX XXXXX - Date Code APW7153/A/B Handling Code Temperature Range Package Code Assembly Material APW 7153A XXXXX APW7153 KA: APW7153 XXXXX XXXXX - Date Code APW 7153B XXXXX |
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