Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Sep., 2012

APW8812

www.anpec.com.tw

3

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance - Junction to Ambient

52

θ

JC

Thermal Resistance - Junction to Case

7

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Note 2:

θ

thermal pad of package is soldered directly on the PCB.

Symbol

Parameter

Rating

Unit

Input Power Voltage (VIN to GND)

-0.3 ~ 28

V

BOOT Supply Voltage (BOOT to PHASE)

-0.3 ~ 7

V

BOOT Supply Voltage (BOOT to GND)

-0.3 ~ 35

V

UGATE Voltage (UGATE to PHASE)

<400ns pulse width

>400ns pulse width

V

LGATE Voltage (LGATE to GND)

<400ns pulse width

>400ns pulse width

V

PHASE Voltage (PHASE to GND)

<400ns pulse width

>400ns pulse width

-5 ~ 35

-0.3 ~ 28

V

All Other Pins (LDOx, FBx, VOUTx, LDO5, LDO3, REF, VCLK, EN

LDO, ENILIMx to GND)

-0.3 ~ 6

V

Maximum Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Recommended Operating Conditions

Symbol

Parameter

Range

Unit

PWM1/2 Converter Input Voltage

6 ~ 25

V

PWM1 Converter Output Voltage

2 ~ 5.5

V

PWM2 Converter Output Voltage

2 ~ 5.5

V

PWM1/2 Converter Input Capacitor (MLCC)

10 ~

µF

LDO Output Capacitor (MLCC)

2.2 ~

µF

Ambient Temperature

-40 ~ 85

Junction Temperature

-40 ~ 125