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AIC1527 Datasheet(PDF) 7 Page - Analog Intergrations Corporation |
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AIC1527 Datasheet(HTML) 7 Page - Analog Intergrations Corporation |
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7 / 8 page  AIC1527 DS-1527-00 May 31, 00 7 PIN 10,14:GND - Chip power return, Connect both pins to ground. PIN 11:IN(C/D) - Channel C AND D power supply input. PIN12(16):OUTC(A) -Channel C(A) MOSFET switch output. PIN15: IN(A/B) - Channel A and B power supply input. n APPLICATION INFORMATIONS l Error Flag An open-drained output of an N-channel MOSFET, the FLG output is pulled low to signal the following fault conditions: input undervoltage, output current limit, and thermal shutdown. l Current Limit The current limit threshold is preset internally. It protects the output MOSFET switches from damage due to undesirable short circuit conditions or excess inrush current often encountered during hot plug-in. The low limit of the current limit threshold of the AIC1527 allows a minimum current of 0.5A through the MOSFET switches. A current limit condition will signal the error flag. l Thermal Shutdown When the chip temperature exceeds 135 °C for any reason other than overcurrent fault of either one of the four MOSFET switches, the thermal shutdown function turns off all MOSFET switches and signal the error flag. A hysteresis of 10℃prevents the MOSFETs from turning back on until the chip temperature drops to below 125 ℃ . However, if thermal shutdown is triggered by chip temperature rise due to overcurrent fault condition of either one of the MOSFET switches, the thermal shutdown function will only turn off the switch that is in overcurrent condition and the other switch can still remain its normal operation. In other words, the thermal shutdown function of the four switches is independent of each other in the case of overcurrent fault. l Supply Filtering A 0.1uF to 1uF bypass capacitor from IN to GND, located near the device, is strongly recommended to control supply transients. Without a bypass capacitor, an output short may cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry. l Transient Droop Requirements USB support dynamic attachment (hot plug-in) of peripherals. A current surge is caused by the input capacitance of downstream device. Ferrite beads are recommended in series with all power and ground connector pins. Ferrite beads reduce EMI and limit the inrush current during hot-attachment by filtering high- frequency signals. l Short Circuit Transient Bulk capacitance provides the short-term transient current needed during a hot-attachment event. With a 33uF, 16V tantalum or 100uF, 10V electrolytic capacitor mounted close to downstream connector per port should provide transient drop protection. l Printed Circuit Layout The power circuitry of USB printed circuit boards requires a customized layout to maximize thermal dissipation and to minimize voltage drop and EMI. |
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