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NPBMAN060PAUNV Datasheet(PDF) 2 Page - Honeywell Solid State Electronics Center

Part # NPBMAN060PAUNV
Description  Basic Board Mount Pressure Sensors: NBP Series??Uncompensated/Unamplified
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Manufacturer  HONEYWELL [Honeywell Solid State Electronics Center]
Direct Link  http://honeywell.com/Pages/Home.aspx
Logo HONEYWELL - Honeywell Solid State Electronics Center

NPBMAN060PAUNV Datasheet(HTML) 2 Page - Honeywell Solid State Electronics Center

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FEATURES AND BENEFITS
Small Size: Package size (as small as 7 mm x 7 mm
[0.276 in x 0.276 in]) is very small when compared to most
board mount pressure sensors, occupying less space on
the PCB and typically allowing for easy placement on
crowded PCBs or in small devices
Durable: Many features allow for use in tough
environments, including:
– Wide operating temperature range from -40 °C to
125 °C [-40 °F to 257 °F]
– Media compatibility options:
o
Non-gel coating: The input port is limited to non-
corrosive, non-ionic media such as dry air and
gases and should not be exposed to
condensation; the gases are limited to media that
are compatible with high temperature polyamide,
silicone, alumina ceramic, silicon, gold, and glass
o
Gel coating: Uses the same materials in the
wetted media path but is protected from
condensation by a silicone-based gel coating;
allows use in applications where condensation can
occur
– ISO 9001 compliance
Flexible: Numerous package styles, pressure ranges,
housings, gel coating, and porting options simplify
integration into the device manufacturer’s application
Robust: Reflow mounting J-STD-020D, MSL 1 and rapid
stabilization after reflow soldering allow calibration
immediately after mounting
POTENTIAL APPLICATIONS
Medical:
Hospital beds
Oxygen concentrators
Wound therapy
Blood pressure
monitoring
Industrial:
HVAC Transmitters
Air movement control
Environmental control
Level indicators
Leak detection
Industrial controls
Pneumatic controls
Other commercial
applications
Table 1. Absolute Maximum Ratings
1
Parameter
Min.
Max.
Unit
Supply voltage (Vsupply)
-12.0
12.0
Vdc
ESD susceptibility (human body model)
2
kV
Storage temperature
-40 [-40]
125 [257]
C [ F]
Soldering time and temperature:
lead solder temperature ( DIP)
peak reflow temperature (Leadless SMT, SMT)
4 s max. at 250 °C [482 °F]
15 s max. at 250 °C [482 °F]
Table 2. Operating Specifications
Parameter
Min.
Typ.
Max.
Unit
Supply voltage (Vsupply)
2
1.8
5.0
3
12.0
Vdc
Supply current (at 5.0 Vdc supply)
1.5
2.5
mA
Specified temperature range
4
-40 [-40]
125 [257]
C [ F]
Accuracy
5
0.25
%FSS BFSL
6
Input resistance
2.4
3.0
5.5
kOhm
Thermal effect on resistance (TCR)
7
1200
3200
ppm/ C
Table 3. Environmental Specifications
Parameter
Characteristic
Humidity:
all external surfaces
internal surfaces of gel coating option
internal surfaces of non-gel coating option
0 %RH to 95 %RH, non-condensing
0 %RH to 100 %RH, condensing
0 %RH to 95 %RH, non-condensing
Vibration
MIL-STD-202F, Method 214A, Condition 1E (15 g, 10 Hz to 2 kHz)
Shock
MIL-STD-202F, Method 213B, Condition F (100g, 6 ms duration)
Life
8
1 million pressure cycles min.
ESD
MIL-STD-883 Method 3015.7, Class 2, 2kV, human body model
Solder reflow
J-STD-020D, MSL 1, unlimited storage life


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