Copyright

© ANPEC Electronics Corp.

Rev. A.8 - May., 2012

APA2068

www.anpec.com.tw

2

Symbol

Parameter

Rating

Unit

Supply Voltage Range

-0.3 to 6

V

Input Voltage Range, SE/BTL, SHUTDOWN, MUTE

V

Maximum Junction Temperature

150

°C

Storage Temperature Range

-65 to +150

°C

Maximum Lead Soldering Temperature,10 Seconds

260

°C

Power Dissipation

Internal Limited

W

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance from Junction to Ambient

(Note 2)

SOP-16P

45

°C/W

θ

JC

Thermal Resistance from Junction to Case

(Note 3)

SOP-16P

10

°C/W

Range

Symbol

Parameter

Min.

Max.

Unit

Supply Voltage

4.5

5.5

V

Operating Ambient Temperature Range

-40

85

°C

Operating Junction Temperature

-

125

°C

SHUTDOWN, MUTE

2

-

High Level Threshold Voltage

SE/BTL

4

-

V

(Over operating free-air temperature range unless otherwise noted.)

Recommended Operating Conditions

Thermal Characteristics

Pin Configuration

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Note 2: The Thermal-Pad on the bottom of the IC should soldered directly to the PCB’s Thermal-Pad area that with several thermal vias

connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz copper thickness.

Note 3: The case temperature is measured at the center of the Thermal-Pad on the underside of the SOP-16P package.

BYPASS 4

13 SE/BTL

VOLMAX 8

GND 5

15 VDD

LIN- 6

12 GND

SHUTDOWN 2

14 ROUT+

RIN- 3

16 ROUT-

11 LOUT+

10 VDD

VOLUME 7

MUTE 1

9 LOUT-

APA2068

= Thermal Pad

(Connected to GND for better heat dissipation)