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APA2605NI-TRG Datasheet(PDF) 4 Page - Anpec Electronics Coropration |
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APA2605NI-TRG Datasheet(HTML) 4 Page - Anpec Electronics Coropration |
4 / 30 page Copyright © ANPEC Electronics Corp. Rev. A.7 - Mar., 2013 www.anpec.com.tw 4 APA2605 Absolute Maximum Ratings (Note 1) Symbol Parameter Rating Unit VDD Supply Voltage (VDD, PVDD, VDC to GND) -0.3 to 6.5 Input Voltage (LINN, RINN to GND) -0.3 to VDD+0.3 Input Voltage (SD, MUTE, AGC, VDC, VOLUME and BYPASS to GND) -0.3 to VDD+0.3 V TJ Maximum Junction Temperature 150 TSTG Storage Temperature Range -65 to +150 TSDR Maximum Soldering Temperature Range, 10 Seconds 260 οC PD Power Dissipation Internally Limited W Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol Parameter Typical Value Unit θ JA Thermal Resistance -Junction to Ambient (Note 2) QFN4x4-20A SSOP-24 SOP-18 SSOP-24P 45 96 70 45 οC/W θ JC Thermal Resistance -Junction to Case (Note 3) QFN4x4-20A SSOP-24 SOP-18 SSOP-24P 7 18 16 11 οC/W Note 2: Please refer to “Layout Recommendation”, the GND PIN on the central of the IC should connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz copper thickness. Note 3: The case temperature is measured at the center of the GND PIN on the underside of the SSOP-24, SOP-18 and QFN 4x4-20A packages. Recommended Operating Conditions Symbol Parameter Range Unit VDD Supply Voltage 3.3 ~ 5.5 VIH High Level Threshold Voltage SD, MUTE 2 ~ VDD VIL Low Level Threshold Voltage SD, MUTE 0 ~ 0.8 VICM Common Mode Input Voltage 1 ~ VDD-1 V TA Ambient Temperature Range -40 ~ 85 TJ Junction Temperature Range -40 ~ 125 οC RL Speaker Resistance 3.5 ~ Ω |
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