Philips Semiconductors

BSH114

N-channel enhancement mode field effect transistor

Product specification

Rev. 01 — 09 November 2000

4 of 13

9397 750 07708

© Philips Electronics N.V. 2000. All rights reserved.

7.

Thermal characteristics

7.1 Transient thermal impedance

Table 4:

Thermal characteristics

Symbol Parameter

Conditions

Value

Unit

thermal resistance from junction to solder point mounted on a metal clad substrate; Figure 4

150

K/W

mounted on a printed circuit board;

minimum footprint

350

K/W

Fig 4.

Transient thermal impedance from junction to solder point as a function of pulse duration.

03ac54

1

10

102

103

10-5

10-4

10-3

10-2

10-1

1

10

(K/W)

0.1

0.2

0.05

0.02

δ = 0.5

single pulse

tp

tp

T

P

t

T