AD9446

Rev. 0 | Page 8 of 36

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

With

Respect

to

Rating

ELECTRICAL

AVDD1

AGND

−0.3 V to +4 V

AVDD2

AGND

−0.3 V to +6 V

DRVDD

DGND

−0.3 V to +4 V

AGND

DGND

−0.3 V to +0.3 V

AVDD1

DRVDD

−4 V to +4 V

AVDD2

DRVDD

−4 V to +6 V

AVDD2

AVDD1

−4 V to +6 V

D0± to D15±

DGND

–0.3 V to DRVDD + 0.3 V

CLK+/CLK−

AGND

–0.3 V to AVDD1 + 0.3 V

OUTPUT MODE,

DCS MODE, DFS

AGND

–0.3 V to AVDD1 + 0.3 V

VIN+, VIN−

AGND

–0.3 V to AVDD2 + 0.3 V

VREF

AGND

–0.3 V to AVDD1 + 0.3 V

SENSE

AGND

–0.3 V to AVDD1 + 0.3 V

REFT, REFB

AGND

–0.3 V to AVDD1 + 0.3 V

ENVIRONMENTAL

Storage Temperature

Range

–65°C to +125°C

Operating Temperature

Range

–40°C to +85°C

Lead Temperature

(Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The heat sink of the AD9446 package must be soldered to

ground.

Table 6.

Package Type

Unit

100-lead TQFP/EP

19.8

8.3

2

°C/W

board in still air.

in still air.

the thermal resistance through heat sink path.

more metal directly in contact with the package leads from

metal traces through holes, ground, and power planes reduces

the ground plane.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.