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TERMINAL FUNCTIONS

NC

VSS

FAULT

IN

OUT

CE

1

2

3

6

8

7

4

5

VBAT

ILIM

bq24314DSG

bq24316DSG

FAULT

NC

VSS

CE

3

4

5

8

10

9

6

7

VBAT

ILIM

2

IN

1

NC

12

OUT

11

bq24314DSJ

bq24316DSJ

IN

NC

OUT

bq24314

bq24316

SLUS763C – JULY 2007 – REVISED OCTOBER 2007

TERMINAL

I/O

DESCRIPTION

NAME

DSJ

DSG

1, 2

1

I

Input power, connect to external DC supply. Connect external 1

μF ceramic capacitor (minimum) to

IN

VSS. For the 12 pin (DSJ-suffix) device, ensure that pins 1 and 2 are connected together on the

PCB at the device.

OUT

10, 11

8

O

Output terminal to the charging system. Connect external 1

μF ceramic capacitor (minimum) to VSS.

VBAT

8

6

I

Battery voltage sense input. Connect to pack positive terminal through a resistor.

9

7

I/O

Input overcurrent threshold programming. Connect a resistor to VSS to set the overcurrent

ILIM

threshold.

CE

7

5

I

Chip enable input. Active low. When CE = High, the input FET is off. Internally pulled down.

Open-drain output, device status. FAULT = Low indicates that the input FET Q1 has been turned off

FAULT

4

4

O

due to input overvoltage, input overcurrent, battery overvoltage, or thermal shutdown.

VSS

3

2

–

Ground terminal

These pins may have internal circuits used for test purposes. Do not make any external connections

NC

5, 6, 12

3

at these pins for normal operation.

There is an internal electrical connection between the exposed thermal pad and the VSS pin of the

Thermal

device. The thermal pad must be connected to the same potential as the VSS pin on the printed

–

PAD

circuit board. Do not use the thermal pad as the primary ground input for the device. The VSS pin

must be connected to ground at all times.

Copyright © 2007, Texas Instruments Incorporated

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