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BQ24316DSGRG4 Datasheet(PDF) 5 Page - Texas Instruments |
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BQ24316DSGRG4 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 26 page www.ti.com TERMINAL FUNCTIONS NC VSS FAULT IN OUT CE 1 2 3 6 8 7 4 5 VBAT ILIM bq24314DSG bq24316DSG FAULT NC VSS CE 3 4 5 8 10 9 6 7 VBAT ILIM 2 IN 1 NC 12 OUT 11 bq24314DSJ bq24316DSJ IN NC OUT bq24314 bq24316 SLUS763C – JULY 2007 – REVISED OCTOBER 2007 TERMINAL I/O DESCRIPTION NAME DSJ DSG 1, 2 1 I Input power, connect to external DC supply. Connect external 1 μF ceramic capacitor (minimum) to IN VSS. For the 12 pin (DSJ-suffix) device, ensure that pins 1 and 2 are connected together on the PCB at the device. OUT 10, 11 8 O Output terminal to the charging system. Connect external 1 μF ceramic capacitor (minimum) to VSS. VBAT 8 6 I Battery voltage sense input. Connect to pack positive terminal through a resistor. 9 7 I/O Input overcurrent threshold programming. Connect a resistor to VSS to set the overcurrent ILIM threshold. CE 7 5 I Chip enable input. Active low. When CE = High, the input FET is off. Internally pulled down. Open-drain output, device status. FAULT = Low indicates that the input FET Q1 has been turned off FAULT 4 4 O due to input overvoltage, input overcurrent, battery overvoltage, or thermal shutdown. VSS 3 2 – Ground terminal These pins may have internal circuits used for test purposes. Do not make any external connections NC 5, 6, 12 3 at these pins for normal operation. There is an internal electrical connection between the exposed thermal pad and the VSS pin of the Thermal device. The thermal pad must be connected to the same potential as the VSS pin on the printed – PAD circuit board. Do not use the thermal pad as the primary ground input for the device. The VSS pin must be connected to ground at all times. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): bq24314 bq24316 |
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