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THS3112CDDA Datasheet(PDF) 2 Page - Texas Instruments |
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THS3112CDDA Datasheet(HTML) 2 Page - Texas Instruments |
2 / 35 page THS3112 THS3115 SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS(1) PACKAGED DEVICE EVALUATION TA SOIC-8 SOIC-8 PowerPAD SOIC-14 TSSOP-14 MODULES (D) (DDA) (D) (PWP) 0°C to +70°C THS3112CD THS3112CDDA THS3115CD THS3115CPWP THS3112EVM THS3115EVM 40°C to +85°C THS3112ID THS3112IDDA THS3115ID THS3115IPWP (1) For the most current specification and package information, refer to the Package Option Addendum located at the end of this data sheet or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature (unless otherwise noted). UNIT Supply voltage, VCC+ to VCC– 33 V Input voltage ±VCC Output current (see (2)) 275 mA Differential input voltage ±4 V Maximum junction temperature +150°C Total power dissipation at (or below) +25°C free-air temperature See Dissipation Ratings Table Commercial 0°C to +70°C Operating free-air temperature, TA Industrial –40°C to +85°C Commercial –65°C to +125°C Storage temperature, Tstg Industrial –65°C to +125°C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The THS3122 and THS3125 may incorporate a PowerPAD™ on the underside of the chip. This pad acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD™ thermally-enhanced package. DISSIPATION RATINGS TABLE TA = +25°C PACKAGE qJA POWER RATING D-8 95°C/W(1) 1.32 W DDA 67°C/W 1.87 W D-14 66.6°C/W(1) 1.88 W PWP 37.5°C/W 3.3 W (1) These data were taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test PCB, the qJA is 168°C/W for the D-8 package and 122.3°C/W for the D-14 package. 2 Submit Documentation Feedback Copyright © 2001–2010, Texas Instruments Incorporated Product Folder Link(s): THS3112 THS3115 |
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