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NCP2890FCT1 Datasheet(PDF) 1 Page - ON Semiconductor |
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NCP2890FCT1 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 16 page © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 10 1 Publication Order Number: NCP2890/D NCP2890, NCV2890 1.0 Watt Audio Power Amplifier The NCP2890 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP2890 is capable of delivering 1.0 W of continuous average power to an 8.0 W BTL load from a 5.0 V power supply, and 320 mW to a 4.0 W BTL load from a 2.6 V power supply. The NCP2890 provides high quality audio while requiring few external components and minimal power consumption. It features a low−power consumption shutdown mode, which is achieved by driving the SHUTDOWN pin with logic low. The NCP2890 contains circuitry to prevent from “pop and click” noise that would otherwise occur during turn−on and turn−off transitions. For maximum flexibility, the NCP2890 provides an externally controlled gain (with resistors), as well as an externally controlled turn−on time (with the bypass capacitor). Due to its excellent PSRR, it can be directly connected to the battery, saving the use of an LDO. This device is available in a 9−Pin Flip−Chip CSP (standard Tin−Lead and Lead−Free versions) and a Micro8 t package. Features • 1.0 W to an 8.0 W BTL Load from a 5.0 V Power Supply • Excellent PSRR: Direct Connection to the Battery • “Pop and Click” Noise Protection Circuit • Ultra Low Current Shutdown Mode • 2.2 V−5.5 V Operation • External Gain Configuration Capability • External Turn−on Time Configuration Capability • Up to 1.0 nF Capacitive Load Driving Capability • Thermal Overload Protection Circuitry • AEC−Q100 Qualified Part Available • Pb−Free Packages are Available • NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes Typical Applications • Portable Electronic Devices • PDAs • Wireless Phones 9−Pin Flip−Chip CSP FC SUFFIX CASE 499E PIN CONNECTIONS XXX = Specific Device Code, A, R = Assembly Location Y = Year WW, W = Work Week G = Pb−Free Package MARKING DIAGRAMS A3 B3 C3 A2 B2 C2 A1 B1 C1 INM OUTA INP VM_P VM Vp BYPASS OUTB SHUTDOWN 8 7 6 5 1 2 3 4 Micro8 DM SUFFIX CASE 846A SHUTDOWN BYPASS INP INM OUTB VM Vp OUTA 1 8 9−Pin Flip−Chip CSP Micro8 (Top View) (Top View) 1 See detailed ordering and shipping information in the package dimensions section on page 14 of this data sheet. ORDERING INFORMATION http://onsemi.com XXX AYWW G A1 A3 C1 XXX RYW G G 1 8 |
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