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NTD5802N Datasheet(PDF) 2 Page - ON Semiconductor

Part # NTD5802N
Description  Power MOSFET 40 V, Single N?묬hannel, 101 A DPAK
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTD5802N Datasheet(HTML) 2 Page - ON Semiconductor

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NTD5802N, NVD5802N
http://onsemi.com
2
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Junction−to−Case (Drain)
RqJC
1.6
°C/W
Junction−to−Ambient − Steady State (Note 1)
RqJA
60
Junction−to−Ambient − Steady State (Note 2)
RqJA
105
1. Surface−mounted on FR4 board using 1 in sq pad size, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = 10 mA
40
V
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V(BR)DSS/TJ
40
mV/°C
Zero Gate Voltage Drain Current
IDSS
VGS = 0 V,
VDS = 40 V
TJ = 25°C
1.0
mA
TJ = 150°C
50
Gate−to−Source Leakage Current
IGSS
VDS = 0 V, VGS = "20 V
"100
nA
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage
VGS(TH)
VGS = VDS, ID = 250 mA
1.5
3.5
V
Negative Threshold Temperature
Coefficient
VGS(TH)/TJ
−7.4
mV/°C
Drain−to−Source On Resistance
RDS(on)
VGS = 10 V, ID = 50 A
3.6
4.4
mW
VGS = 5.0 V, ID = 50 A
6.5
7.8
Forward Transconductance
gFS
VDS = 15 V, ID = 15 A
16.8
S
CHARGES AND CAPACITANCES
Input Capacitance
Ciss
VGS = 0 V, f = 1.0 MHz,
VDS = 12 V
5300
pF
Output Capacitance
Coss
850
Reverse Transfer Capacitance
Crss
550
Input Capacitance
Ciss
VGS = 0 V, f = 1.0 MHz,
VDS = 25 V
5025
pF
Output Capacitance
Coss
580
Reverse Transfer Capacitance
Crss
400
Total Gate Charge
QG(TOT)
VGS = 10 V, VDS = 15 V,
ID = 50 A
75
100
nC
Threshold Gate Charge
QG(TH)
6.0
Gate−to−Source Charge
QGS
18
Gate−to−Drain Charge
QGD
15
SWITCHING CHARACTERISTICS (Note 4)
Turn−On Delay Time
td(on)
VGS = 10 V, VDS = 20 V,
ID = 50 A, RG = 2.0 W
14
ns
Rise Time
tr
52
Turn−Off Delay Time
td(off)
39
Fall Time
tf
8.5
3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
4. Switching characteristics are independent of operating junction temperatures.


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