ONET1151L

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SLLSEI7 – DECEMBER 2013

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

–0.3

4.0

Voltage at ADR0, ADR1, DIS, RZTC, SCK, SDA, DIN+, DIN–,

–0.3

4.0

V

(2)

Max current at input pins

25

mA

Max current at output pins

120

ESD

ESD rating at all pins

2

kV (HBM)

Maximum junction temperature

125

Storage temperature range

–65

150

°C

Case temperature

–40

110

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

RECOMMENDED OPERATING CONDITIONS

Over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITION

MIN

NOM

MAX

UNIT

Supply voltage

2.8

3.3

3.63

Digital input high voltage

DIS, SCK, SDA, ADR0, ADR1

2

V

Digital input low voltage

DIS, SCK, SDA

0.8

Photodiode current range

Control bit PDRNG = 1X, step size = 3 µA

3 080

Control bit PDRNG = 01, step size = 1.5 µA

1 540

µA

Control bit PDRNG = 00, step size = 0.75 µA

770

1.16-V band-gap bias across resistor, E96, 1%

28.4

28.7

29

k

Ω

accuracy

Differential input voltage swing

150

1200

Temperature at the thermal pad

–40

100

°C

(1)

Changing the value will alter the DAC ranges.

Copyright © 2013, Texas Instruments Incorporated

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