VCC_IN

GND

OUT+

GND

RSSI_IB

OUT±

GND

GND

VCC_OUT

RSSI_EB

1

2

3

6

8

4

7

5

14

13

12

16

9

10

15

18

11

8551T

17

20 19

ONET8551T

SLLSEI5 – OCTOBER 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Bond Pad Assignment of ONET8551T

(TOP VIEW)

Figure 1. The ONET8551T is available in die form. Bond pad locations are shown in this top view.

Table 1. BOND PAD DESCRIPTION

Pad

Symbol

Type

Description

1, 3, 6, 10, 14,

GND

Supply

Circuit ground. All GND pads are connected on die. Bonding all pads is optional. However,

16, 18, 19

for optimum performance, a good ground connection is mandatory.

2

OUT+

Analog output

Non-inverted CML data output; on-chip 50-

4

VCC_OUT Supply

2.8-V to 3.63-V supply voltage for AGC amplifier

5

VCC_IN

Supply

2.8-V to 3.63-V supply voltage for input TIA stage

7, 9

FILTER

Analog

Bias voltage for photodiode cathode

8

IN

Analog input

Data input to TIA (photodiode anode)

11

NC

No connect

Do not connect

12

RSSI_IB

Analog output

Analog output current is proportional to the input data amplitude. It indicates the strength of

the received signal (RSSI), if the photodiode is biased from the TIA. Connected to an external

resistor to ground (GND). For proper operation, ensure that the voltage at the RSSI pad does

13

RSSI_EB

Analog output

Optional use when operated with external PD bias (e.g. APD). Analog output current

proportional to the input data amplitude. Indicates the strength of the received signal (RSSI).

Connected to an external resistor to ground (GND). For proper operation, ensure that the

feature is not used.

15

OUT–

Analog output

Inverted CML data output; on-chip 50-

17

BW1

Digital input

20

BW0

Digital input

Back-side of

GND

Supply

Conductive epoxy must be used to attach the die to ground.

die

2

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