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ONET8551T Datasheet(PDF) 2 Page - Texas Instruments |
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ONET8551T Datasheet(HTML) 2 Page - Texas Instruments |
2 / 16 page VCC_IN GND OUT+ GND RSSI_IB OUT± GND GND VCC_OUT RSSI_EB 1 2 3 6 8 4 7 5 14 13 12 16 9 10 15 18 11 8551T 17 20 19 ONET8551T SLLSEI5 – OCTOBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Bond Pad Assignment of ONET8551T (TOP VIEW) Figure 1. The ONET8551T is available in die form. Bond pad locations are shown in this top view. Table 1. BOND PAD DESCRIPTION Pad Symbol Type Description 1, 3, 6, 10, 14, GND Supply Circuit ground. All GND pads are connected on die. Bonding all pads is optional. However, 16, 18, 19 for optimum performance, a good ground connection is mandatory. 2 OUT+ Analog output Non-inverted CML data output; on-chip 50- Ω back-terminated to VCC 4 VCC_OUT Supply 2.8-V to 3.63-V supply voltage for AGC amplifier 5 VCC_IN Supply 2.8-V to 3.63-V supply voltage for input TIA stage 7, 9 FILTER Analog Bias voltage for photodiode cathode 8 IN Analog input Data input to TIA (photodiode anode) 11 NC No connect Do not connect 12 RSSI_IB Analog output Analog output current is proportional to the input data amplitude. It indicates the strength of the received signal (RSSI), if the photodiode is biased from the TIA. Connected to an external resistor to ground (GND). For proper operation, ensure that the voltage at the RSSI pad does not exceed VCC – 0.65 V. Leave this pad open if the RSSI feature is not used. 13 RSSI_EB Analog output Optional use when operated with external PD bias (e.g. APD). Analog output current proportional to the input data amplitude. Indicates the strength of the received signal (RSSI). Connected to an external resistor to ground (GND). For proper operation, ensure that the voltage at the RSSI pad does not exceed VCC – 0.65 V. Leave this pad open if the RSSI feature is not used. 15 OUT– Analog output Inverted CML data output; on-chip 50- Ω back-terminated to VCC. 17 BW1 Digital input Bandwidth adjustment. Ground the pad to increase the bandwidth. Internally pulled-up to VCC 20 BW0 Digital input Bandwidth adjustment. Ground the pad to increase the bandwidth. Internally pulled-up to VCC Back-side of GND Supply Conductive epoxy must be used to attach the die to ground. die 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: ONET8551T |
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