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TLV70030-Q1 Datasheet(PDF) 9 Page - Texas Instruments |
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TLV70030-Q1 Datasheet(HTML) 9 Page - Texas Instruments |
9 / 19 page TLV70012A-Q1, TLV70025-Q1, TLV70028-Q1 TLV70030-Q1, TLV70032-Q1, TLV70033-Q1 www.ti.com SLVSA61F – FEBRUARY 2010 – REVISED AUGUST 2013 APPLICATION INFORMATION The TLV700xx-Q1 belongs to a new family of next-generation value LDO regulators. It consumes low quiescent current and delivers excellent line and load transient performance. These characteristics, combined with low noise, very good PSRR with little (VIN – VOUT) headroom, make this device ideal for RF portable applications. This family of regulators offers subband-gap output voltages down to 0.7 V, current limit, and thermal protection, and is specified from –40°C to 125°C. Input and Output Capacitor Requirements 1.0- μF X5R- and X7R-type ceramic capacitors are recommended because these capacitors have minimal variation in value and equivalent series resistance (ESR) over temperature. However, the TLV700xx-Q1 is designed to be stable with an effective capacitance of 0.1 μF or larger at the output. Thus, the device is stable with capacitors of other dielectric types as well, as long as the effective capacitance under operating bias voltage and temperature is greater than 0.1 μF. This effective capacitance refers to the capacitance that the LDO sees under operating bias voltage and temperature conditions; that is, the capacitance after taking both bias voltage and temperature derating into consideration. In addition to allowing the use of cheaper dielectrics, this capability of being stable with 0.1- μF effective capacitance also enables the use of smaller-footprint capacitors that have higher derating in size- and space-constrained applications. Note that using a 0.1- μF rated capacitor at the output of the LDO does not ensure stability because the effective capacitance under the specified operating conditions would be less than 0.1 μF. Maximum ESR should be less than 200 m Ω. Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1- μF to 1- μF, low-ESR capacitor across the IN pin and GND in of the regulator. This capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if large, fast rise-time load transients are anticipated, or if the device is not located close to the power source. If source impedance is more than 2 Ω, a 0.1-μF input capacitor may be necessary to ensure stability. Board Layout Recommendations to Improve PSRR and Noise Performance Input and output capacitors should be placed as close to the device pins as possible. To improve ac performance such as PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for VIN and VOUT, with the ground plane connected only at the GND pin of the device. In addition, the ground connection for the output capacitor should be connected directly to the GND pin of the device. High-ESR capacitors may degrade PSRR performance. Internal Current Limit The TLV700xx-Q1 internal current limit helps to protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of the output voltage. In such a case, the output voltage is not regulated, and is VOUT = ILIMIT × RLOAD. The PMOS pass transistor dissipates (VIN – VOUT) × ILIMIT until thermal shutdown is triggered and the device turns off. As the device cools down, it is turned on by the internal thermal-shutdown circuit. If the fault condition continues, the device cycles between current limit and thermal shutdown. See the Thermal Information section for more details. The PMOS pass element in the TLV700xx-Q1 has a built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, external limiting to 5% of the rated output current is recommended. Shutdown The enable pin (EN) is active-high and is compatible with standard and low-voltage TTL-CMOS levels. When shutdown capability is not required, EN can be connected to the IN pin. Dropout Voltage The TLV700xx-Q1 uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout voltage (VDO), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the rDS(on) of the PMOS pass element. VDO scales approximately with output current because the PMOS device behaves as a resistor in dropout. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: TLV70012A-Q1 TLV70025-Q1 TLV70028-Q1 TLV70030-Q1 TLV70032-Q1 TLV70033-Q1 |
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